Tessco Wireless Journal September October 2016 Page 1 TESSCO Wireless Journal September-October 2016

PLEASE reference this code when ordering from this issue. Technical accuracy is the responsibility of the author(s). 08005 Feature Article NYU Wireless Leads the Drive Toward a New Kind of Network Page 1 Feature Article USB Demystified: New Updates to the Established Standard Page 1 Feature Article A Nuclear Power Plant's Winning Strategy For Updating Their DAS Page 3 Data Line Surge Protectors From Times Microwave Page 5 Cambium Networks Brings Interference Tolerance To A Whole New Level Page 10 Faster Copper & Fiber Certification From Fluke Networks Page 12 New Power Line Monitoring Antenna From PCTel Page 13 Safeguard Computers & Devices With ChargeGuard From Havis Page 13 Special New Shop Supply Poster Inside (continued on page 3) (continued on page 2) The Wireless Journal VOLUME 23 NO. 4 September/October 2016 wirelessjournal.tessco.com System and Product Reviews for Those Who Build, Use and Maintain Wireless PRSRT STD US POSTAGE PAID DENVER, CO PERMIT NO. 5377 NYU Wireless Leads the Drive Toward a New Kind of Network By Jerry Moyer, Director of Strategy & Analytics, TESSCO Technologies The next generation of cellular is on the horizon and it faces plenty of challenges. Mobile devices continue to become more ubiquitous and are relied on more and more for crucial, every day uses. Combined with users' expectations for consistent, reliable service everywhere and anywhere, and the continued development of new applications of connectivity in the Internet of Things, the new 5G network will have its work cut out for it. So what is being done to ensure the new network can overcome these challenges and continue our move towards a completely connected world? Researchers at New York University have de- veloped testbeds and, using data from prototype equipment around the city, they are working on establishing standards for what 5G will be, what it needs to do, and how it's going to do it. One of the greatest challenges they've identified is the need for the next generation network to keep pace with data demands, which are constantly increasing. This will require additional capacity at a lower cost, and the lab at NYU, led by Professor Sundeep Rangan, is developing a solution for a cheap, self-organizing network. "I first saw the magic date of 2020 in a Cisco IoT article," explained Bill Moten, TESSCO VP for Solutions Development. "They predicted there will be 50 billion connected devices in the world, more than 6.5 devices per person. There is no standard yet for 5G but we know what the requirements are: it must have multi-gigabit per second downlink, it must improve latency under one millisecond, and it needs better efficiency than 4G to meet those demands." "Speed is great," Moten added, "but the latency improvements are going to enable a lot more au- tonomous actions where real time is important." Also leading the efforts to develop 5G is the founding director of NYU Wireless, Professor Ted Rappaport, who was instrumental in raising awareness of mmWave technology as the key to expanding bandwidth for 5G. Millimeter wave, or mmWave, is the spectrum that exists between 30 and 300 gigahertz. Most of the lower spectrum, between 700 Mhz and 2.6 Ghz, is in use as part of our current 4G networks and in order to accom- modate the advancements in 5G, more "room" on the cellular spectrum is needed. Utilizing these new spectrum bands will also make fiber optic Wi-Fi more accessible and affordable and improve service and reception in densely populated or isolated areas. "Millimeter wave is great for speed and low latency," Moten said about the possibilities of mmWave. "However, attenuation at that frequency will require a more robust infrastructure. There's USB Demystified: New Updates to the Established Standard By Sean Fitzgibbons, TESSCO Technologies, Power & Connectivity Product Manager USB has been a staple of technology for two decades, and its creation marked a revolution in the standardization of computer peripherals. When Intel, Compaq, Dell, IBM, Microsoft, and others created the USB Implementers Forum and introduced USB 1.0 in 1996 it made plug-and-play connectivity a reality for early PC components. Now, USB has contin- ued to evolve alongside the rest of technology, expanding its capabilities and the flexibility avail- able to users. SuperSpeed USB, introduced with USB 3.0 in 2008, allowed for faster, 5 Gbps transfer speeds and introduced the bi-directional data connection for the first time, allowing devices to transmit data and receive it simultaneously. USB 3.1 marked an upgrade to SuperSpeed USB, doubling the data rate to 10 Gbps with improved coding efficiency. Introduced in 2014, USB Type C is a new itera- tion of USB hardware, separate from SuperSpeed USB. Having Type C does not necessarily mean a device has SuperSpeed USB, and SuperSpeed USB doesn't require Type C. However, Type C is becoming the most common standard on new computers and devices thanks to its flexibility, streamlined function, and forward-thinking design. Type C connecters are reversible and symmetrical, eliminating the all too familiar annoyance of plugging in the connecter the wrong direction. Type C also features a 24 pin connecter, but does not currently utilize all 24 pins. This was done to make Type C a future-proof technology, capable of accommodating new advancements without needing updates to the hardware. Currently Type C supports standard USB 3.1 and 2.0, Digital Audio, and alternate modes of connection like Displayport, MHL, and Thunderbolt 3. This versatility allows for simpler computer set ups and is a key feature for busi- ness applications. Instead of having multiple connecters and components, it's now possible to utilize a modular computer station with a dock that connects components to a laptop as needed. 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